1 |
技術原理 |
2 |
儀器規格 |
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I. |
機型:Leica TCS SP8X STED |
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II. |
光源: |
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i. |
Visible laser |
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A. |
White light laser system: pulsed laser |
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B. |
Super continuous exciting range: 470nm-670nm |
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C. |
1nm adjustable |
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D. |
>1mW for each wavelength |
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ii. |
UV laser |
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A. |
405nm laser |
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B. |
50mW |
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III. |
顯微鏡:LEICA DMi8 倒立顯微鏡 壹台 |
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IV. |
物鏡: |
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i. |
Plan Fluotar 5x, dry, NA 0.15, WD≧13.7mm |
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ii. |
Plan APO 10x, dry, NA 0.40, WD≧2.2mm |
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iii. |
Plan APO 20x, NA 0.70, coverglass, WD≧0.59mm |
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iv |
Plan APO 40x, oil, NA 1.30, WD≧0.24mm |
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v |
Plan APO 63x, oil, NA 1.40, WD≧0.14mm |
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vi |
Plan APO 63x, glyc, NA 1.30, CORR, WD≧0.3mm |
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vii |
Plan APO 93x, glyc, NA 1.30, motC STED WLL , WD≧0.3mm |
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viii |
Plan APO 100x, oil, NA 1.40, STED WHITE , WD≧0.09mm |
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V. |
掃瞄器: |
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i. |
for UV/405 nm-VIS-IR-gSTED with 4 independent laser ports |
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ii. |
Light gate FLIM technology |
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iii. |
High resolution scan mode: |
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A. |
Scan field of view(FOV) at least 22 mm, speed 7fps@512x512 in FOV 22mm, 84fps @ 512 x 16 |
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B. |
Max. scan resolution 8192 x 8192, 16 bits grey scale, digitalization 12bits or 18 bits. |
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VI. |
CCD: |
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i. |
1.4 Mpixel (1392 x 1040) |
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ii. |
Exposure time 4us-10min |
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VII. |
影像擷取形式: |
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i. |
Bright field |
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ii. |
Fluorescence |
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iii. |
Reflection |
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iiii. |
Normaski differential interference contrast (DIC) |
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VIII. |
Build-in Scanner' confocal detector: |
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Multi-band Spectrophotometer(380-800 nm)with 4PMT tube (2 cooling hybrid GaAsP/APD detectors + 2 cooled PMT detectors) |
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IX. |
3D STED module |
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i. |
592nm STED laser |
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ii. |
660nm STED laser |
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iii. |
775nm STED laser |
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iv. |
Resolution dxy~30nm, dz<100nm |
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v. |
3D STED device |
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X. |
Incubation system |
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XI. |
軟體: |
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i. |
Leica Application Suite X |
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ii. |
Imaris 3D/4D real time image software |
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iii. |
Metamorph image analysis software |